SEKUNOWO, O.; DUROWAYE, S.; FASHAKIN, G. Electrical and Thermal Characterisation of Millscale Modified Sn-Cu Lead-Free Solders. Journal of the Institute of Engineering, [S. l.], v. 15, n. 1, p. 37–46, 2019. DOI: 10.3126/jie.v15i1.27702. Disponível em: https://nepjol.info/index.php/JIE/article/view/27702. Acesso em: 21 nov. 2024.